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项目/Item 类型/Description 备注/Remark
层数
Layer
软板/Flex board: 1-8Layers  
软硬结合/Flex-Rigid Board: 2-10Layers
材料
Material
PI, PET, PEN, FR-4,透明PI,厚铜  
完成板厚
Final Thickness
软板/Flex board: 0.002" - 0.1" (0.05-2.5mm)  
软硬结合/Flex-rigid board: 0.0024" - 0.16" (0.06-4.0mm)
表面处理
Surface Treatment
化学沉金,电镀镍金,沉银、沉锡,电厚金
Lead-free: ENG Gold; OSP, Immersion silver, Immersion Tin
 
最大/最小板尺寸
Max / Min Board Size
最小/Min: 0.2"x0.3"  最大/Max: 20.5"x13"  
最小线宽/线距
Min Trace Width / Min Clearance
内层Inner  外层Outer  
1/3oz: 3/2mil 1/3oz: 3/2mil
1/2oz: 3/3mil 1/2oz: 3/2mil
1oz: 4/4mil 1oz: 5/5mil
2oz: 5/7mil 2oz: 5/7mil
最小孔环
Min Hole Ring
1/3oz-0.5oz: 4mil 1/3oz-0.5oz: 4mil  
1oz: 5mil 1oz: 5mil
2oz: 7mil 2oz: 7mil
铜厚
Copper Thickness
1/3oz - 2oz  
最大/最小绝缘厚度
Max / Min Insulation Thickness
2mil/0.5mil (50um/12.7um)  
最小钻孔/公差
Min Hole Size and Tolerance
Min hole: 4mil  
Tolerance: PTH±3mil, NPTH±2mil
最小槽孔
Min Slot
24mil x 35mil (0.6x0.9mm)  
保护膜颜色
Coverlay color
白色,黑色,黄色,透明
white,black,yellow,transparent
 
保护膜对位公差
Coverlay
Alignment Tolerance
±3mil  
丝印对位公差
Silkscreen Alignment Tolerance
±6mil  
最小字符线宽
Silkscreen Line Width
5mil  
Gold Plating Nickel: 80u" - 120u" Gold: 1u"-15u"  
Immersion Nickel / Gold Nickel: 80u" - 120u" Gold: 1u"-3u"  
Immersion Silver Silver: 6u" - 12u"  
OSP Film: 8u" - 20u"  
测试电压/Test Voltage Testing Fixture: 50-300V  
成型
Profile
外形/Outline: ±0.05mm  
保护膜/Coverlay: ±0.2mm

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